Explore our core product lines engineered for high-precision semiconductor fabrication, crystal growth, and advanced thermal management applications.
As semiconductor nodes shrink below 5nm and chip power densities continue to rise, the material requirements for process equipment become increasingly stringent. Molybdenum has emerged as the material of choice for critical semiconductor components.
With a melting point of 2,623°C, molybdenum plates maintain structural integrity throughout CVD, PVD, ion implantation, and diffusion furnace processes where temperatures routinely exceed 1,200°C.
Molybdenum's electrical resistivity of ~5.2 μΩ·cm ensures excellent performance in electrode applications, sputtering targets, and interconnect substrates within advanced integrated circuit fabrication.
High-purity molybdenum (≥99.95%) exhibits outstanding resistance to most semiconductor process chemicals, preventing contamination of ultra-clean fab environments and protecting wafer yield.
Advanced rolling and precision machining processes enable molybdenum sheets to achieve flatness tolerances within ±0.05mm and surface roughness Ra ≤0.4μm, meeting the exacting demands of lithography and deposition tooling.
A tensile strength exceeding 700 MPa at room temperature, combined with good ductility after proper processing, allows molybdenum plates to withstand mechanical stresses in high-vacuum, high-temperature semiconductor process chambers.
Molybdenum's extremely low vapor pressure at elevated temperatures is critical for ultra-high vacuum (UHV) environments in electron beam evaporation, MBE systems, and ion implantation chambers.
The global semiconductor industry's relentless pursuit of miniaturization, higher performance, and energy efficiency is driving unprecedented demand for precision molybdenum materials.
The global molybdenum market for semiconductor applications is projected to grow at a CAGR exceeding 8% through 2030, driven by expanding fab capacity in Asia, North America, and Europe. The proliferation of AI chips, 5G infrastructure, and automotive-grade semiconductors is accelerating this growth trajectory significantly.
With TSMC, Samsung, Intel, and emerging Chinese fabs investing over $500 billion in new capacity through 2026, the demand for high-purity molybdenum plates and process components is experiencing structural growth. Governments worldwide are incentivizing domestic supply chains, creating new opportunities for qualified specialty metal suppliers.
As lithography advances from EUV to High-NA EUV, the precision requirements for molybdenum components in pellicle frames, reticle stages, and thermal management substrates have intensified dramatically. Sub-angstrom surface quality and parts-per-billion purity levels are now standard expectations.
The semiconductor industry's net-zero commitments are driving adoption of longer-lifetime, recyclable molybdenum components that reduce process waste and consumable replacement cycles. Molybdenum's recyclability and durability align perfectly with circular economy principles in modern fabs.
From front-end wafer processing to back-end packaging, molybdenum plates and sheets serve as indispensable functional materials across the entire semiconductor value chain.
| Application Scenario | Molybdenum Component | Critical Property Required | Typical Specification |
|---|---|---|---|
| PVD Sputtering Systems | Sputtering Target Backing Plate | Thermal conductivity, CTE match | Purity ≥99.95%, Thickness 3–25mm |
| Diffusion Furnaces | Boat Supports, Susceptors | High-temp stability, chemical inertness | Mo-1 grade, 1200°C+ rated |
| Ion Implantation | Beam Apertures, Shields | Low vapor pressure, machinability | Flatness ±0.05mm, Ra ≤0.8μm |
| MOCVD / Epitaxy | Susceptor Plates, Liner Sheets | Thermal uniformity, purity | ≥99.97% purity, custom geometry |
| Power Device Packaging | Heat Spreader / Substrate | CTE matching Si, thermal conductivity | Mo-Cu composite or pure Mo sheet |
| EUV Lithography | Pellicle Frame, Reticle Components | Ultra-low CTE, dimensional stability | Surface flatness ≤λ/10, ultra-clean |
| Crystal Growth (CZ/FZ) | Thermal Field Plates, Heat Shields | High-temp strength, low contamination | TZM or pure Mo, 1600°C+ service |
In physical vapor deposition systems, molybdenum backing plates provide the structural foundation for precious metal sputtering targets (Ti, Ta, Cu, W). Their superior thermal conductivity (138 W/m·K) ensures efficient heat dissipation during plasma bombardment, extending target life and maintaining film uniformity across 300mm wafers.
Czochralski (CZ) and Float Zone (FZ) silicon crystal growth furnaces rely on precision molybdenum plates for heat shields, reflectors, and thermal field assemblies. Operating continuously above 1,400°C in inert atmospheres, these components must maintain dimensional stability and resist silicon melt contamination over thousands of production hours.
SiC and GaN power devices generate extreme localized heat densities. Molybdenum's CTE of 4.8 ppm/°C bridges the thermal mismatch between silicon carbide die (4.0 ppm/°C) and copper substrates, preventing delamination and solder fatigue in high-reliability automotive and industrial power modules.
High-energy ion beams in implantation equipment require precision aperture plates and beam-shaping shields fabricated from molybdenum. The material's self-sputtering resistance and dimensional stability under ion bombardment are critical for maintaining beam collimation accuracy in advanced doping processes.
Metal-organic chemical vapor deposition of GaAs, InP, and GaN epitaxial layers requires susceptor plates with exceptional thermal uniformity. Precision-machined molybdenum susceptors ensure ±1°C temperature uniformity across the wafer surface, directly impacting LED efficiency, laser diode performance, and HEMT transistor characteristics.
Extreme ultraviolet lithography systems operating at 13.5nm wavelengths demand molybdenum/silicon multilayer mirrors and pellicle frame structures with atomic-level precision. Molybdenum's compatibility with EUV optics fabrication makes it indispensable for pushing semiconductor manufacturing beyond the 2nm node.
Our molybdenum plates and sheets are manufactured to meet the most demanding semiconductor industry standards, with full traceability and comprehensive quality documentation.
| Parameter | Standard Grade | High-Purity Grade | TZM Alloy Grade |
|---|---|---|---|
| Purity / Composition | Mo ≥99.90% | Mo ≥99.95% | Mo-0.5Ti-0.08Zr-0.02C |
| Thickness Range | 0.3 – 50 mm | 0.3 – 30 mm | 1.0 – 50 mm |
| Width Range | Up to 600 mm | Up to 500 mm | Up to 600 mm |
| Surface Roughness | Ra ≤ 1.6 μm | Ra ≤ 0.4 μm | Ra ≤ 0.8 μm |
| Flatness Tolerance | ±0.10 mm | ±0.05 mm | ±0.08 mm |
| Density | ≥10.15 g/cm³ | ≥10.20 g/cm³ | ≥10.10 g/cm³ |
| Max Service Temp. | 1,400°C (inert) | 1,600°C (vacuum) | 1,800°C (vacuum) |
| Custom Processing | Cutting, grinding | Precision machining, EDM | Full CNC, EDM, laser |
Founded in 1995 and headquartered in Baoji, Shaanxi—China's "Titanium Valley" and the country's largest base for rare-metal processing—Baoji Yunjie Metal Products Co., Ltd. has specialized for over three decades in refractory and specialty metals, including tungsten, molybdenum, tantalum, niobium, titanium, nickel, and zirconium. Today, Yunjie is recognized as a leading specialist and innovator in the region's specialty-metal processing industry.
Yunjie operates a 15,000 m² manufacturing campus with 8,000 m² of integrated R&D, production, and office facilities, and a registered capital of RMB 15 million. The company has established comprehensive quality management, production assurance, and in-house R&D and innovation systems—providing end-to-end, hardware-to-process control that underpins stable quality and supports large-scale, high-precision manufacturing.
Contact Us
Named a "Gazelle Enterprise" by Baoji High-tech Zone; certified by the Shaanxi Department of Industry and Information Technology as a "Specialized, Refined, Characteristic & Innovative (SRDI)" SME and a High-tech Enterprise.
Awarded Shaanxi Hidden Champion Enterprise, Demonstration Enterprise for Transformation & Upgrading of the Private Economy, and Shaanxi Industrial Premium Product Enterprise.
Upgraded to a Municipal-level R&D Institution for Industrial Enterprises (Baoji); in October 2024, accredited as a Baoji Municipal Military-Civil Fusion Enterprise. These credentials reflect Yunjie's growing industry recognition.
Focusing on special metals and alloys (W, Mo, Ti, Ta, Nb, Zr, Ni), Yunjie runs complete processing lines—including rolling (calendering), heat treatment, and sheet-metal & precision machining—enabling full in-house control from raw-material processing to finished-product delivery.
Yunjie's molybdenum plates and sheets are trusted by leading manufacturers across the world's most demanding technology sectors.
Guided by the principle "Quality ensures survival, efficiency drives growth, and continuous improvement earns customer satisfaction," Yunjie has continuously upgraded its quality systems for more than 30 years. With professional manufacturing services and consistently excellent product performance, we have earned the lasting trust of customers in China and around the world.
Every molybdenum plate and sheet destined for semiconductor applications undergoes rigorous multi-stage quality inspection including chemical composition analysis (ICP-MS), dimensional verification, density measurement, surface defect inspection (ultrasonic testing), and mechanical property testing—ensuring zero-defect delivery to our global semiconductor customers.
Beyond molybdenum plates and sheets, Yunjie offers a comprehensive portfolio of refractory and specialty metal products to support your complete manufacturing needs.
Our engineering team is ready to assist with material selection, custom specifications, and rapid prototyping for your semiconductor component requirements. Contact Yunjie today for expert consultation and competitive pricing.
Request a Quote Download Catalog
